Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2007-12-25
2007-12-25
Doan, Theresa T (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S780000, C257SE21069, C257SE21062, C438S613000
Reexamination Certificate
active
11160669
ABSTRACT:
An electrical structure and method comprising a first substrate electrically and mechanically connected to a second substrate. The first substrate comprises a first electrically conductive pad and a second electrically conductive pad. The second substrate comprises a third electrically conductive pad, a fourth electrically conductive pad, and a first electrically conductive member. The fourth electrically conductive pad comprises a height that is different than a height of the first electrically conductive member. The electrically conductive member is electrically and mechanically connected to the fourth electrically conductive pad. A first solder ball connects the first electrically conductive pad to the third electrically conductive pad. The first solder ball comprises a first diameter. A second solder ball connects the second electrically conductive pad to the first electrically conductive member. The second solder ball comprises a second diameter. The first diameter is greater than said second diameter.
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Clevenger Lawrence
Farooq Mukta G.
Hsu Louis L.
Landers William F.
Radens Carl J.
Capella Steven
Doan Theresa T
Harding Sarah K
International Business Machines - Corporation
Schmeiser Olsen & Watts
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