Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-05-05
2010-11-09
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S693000, C257S773000, C257S780000, C257S783000, C257S787000, C257SE23021, C257SE23069, C438S612000, C438S613000, C438S614000
Reexamination Certificate
active
07830006
ABSTRACT:
A chip scale integrated circuit package includes an integrated circuit chip which has a first face and a second face. A plurality of pillar bumps are formed on the first face of the integrated circuit chip. An encapsulant material encapsulates the sides and the first face of the integrated circuit chip, and the pillar bumps. Upper ends of the pillar bumps remain free from encapsulant material and a substantially planar surface is formed by an upper surface of the encapsulant material and the upper ends of the pillar bumps. A plurality of solder balls are mounted on the substantially planar surface in locations corresponding to the upper ends of the pillar bumps.
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Kanth Kolan Ravi
Lim Beng Kuan
Sivalingam Krishnamoorthi
Sun Anthony Yi Sheng
Tan Hien Boon
Clark Jasmine J
Sughrue & Mion, PLLC
United Test and Assembly Center Ltd.
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