Standoff height improvement for bumping technology using...

Details Standoff height improvement for bumping technology using... Standoff height improvement for bumping technology using...

2007-05-21

2009-11-10

Le, Thao P. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C438S612000, C257SE21508

Reexamination Certificate

active

07615865

ABSTRACT:
A system to support a die includes a substrate. A solder resist is disposed over the substrate. A first solder bump is disposed in the solder resist to provide electrical connectivity through the solder resist to the substrate. A second solder bump is formed over the solder resist to correspond with a peripheral edge or a corner of the die. The second solder bump provides standoff height physical support to the die.

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