Standing chip scale package

Details Standing chip scale package Standing chip scale package

2010-08-09

2011-11-15

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S737000, C257SE23021, C257SE23022, C257SE23023, C257SE23069

Reexamination Certificate

active

08058727

ABSTRACT:
A standing chip scale package is disclosed. The standing chip scale package provides electrical connection to bumped device contacts on both sides of the chip. The package is coupleable to a printed circuit board in a standing configuration such that front and back sides of the bumped chip are substantially perpendicular to a mounting surface. A process of fabricating the standing chip scale package is also disclosed.

REFERENCES:
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patent: 6392305 (2002-05-01), Huang et al.
patent: 6646329 (2003-11-01), Estacio et al.
patent: 6653740 (2003-11-01), Kinzer et al.
patent: 6767820 (2004-07-01), Standing et al.
patent: 6841416 (2005-01-01), Yoon et al.
patent: 7029947 (2006-04-01), Joshi
patent: 7095226 (2006-08-01), Wan et al.
patent: 2005/0122100 (2005-06-01), Wan et al.

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