Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-06-21
2005-06-21
Fahmy, Wael (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S732000, C257S734000
Reexamination Certificate
active
06909182
ABSTRACT:
A spherical semiconductor device includes a spherical semiconductor element having one or more electrodes on its surface. Spherical conductive bumps are formed at the positions of the electrodes. The electrodes are so arranged as to contact a common plane. Spherical bumps constituting a group to be connected to the outside protrude above the spherical semiconductor element such that a predetermined gap is formed between a plane or a spherical surface capable of contacting the spherical bumps and the surface of the spherical semiconductor element. The spherical semiconductor device is connected to various circuit boards or another semiconductor device through the spherical bumps. This affords easy and accurate electrical connections to the outside.
REFERENCES:
patent: 6245630 (2001-06-01), Ishikawa
patent: 2003/0166331 (2003-09-01), Tong et al.
“Nikkei Microdevices publication”, Japan, Jul. 1, 1998.
Fukano Atsuyuki
Hashino Eiji
Shimokawa Kenji
Takeda Nobuo
Tatsumi Kohei
Ball Semiconductor Corporation
Connolly Bove & Lodge & Hutz LLP
Fahmy Wael
Ha Nathan W.
Hume, Esq. Larry J.
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