Substrate based IC-package

Details Substrate based IC-package Substrate based IC-package

2007-07-17

2007-07-17

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE23069

Reexamination Certificate

active

11190068

ABSTRACT:
A semiconductor component comprises a substrate that includes wiring on a first surface. A chip is mounted on a second surface of the substrate by a die attach, the second surface opposite the first surface. A bond channel in the center of the substrate allows for electrical connection of contact pads on the wiring with bond pads arranged in a center row on the chip by wire loops. A housing made of a mold compound surrounds a backside of the chip and parts of the substrate adjacent to the wiring. The semiconductor component further comprises a rigid prepreg layer covering, as well as the wiring of the substrate and the prepreg layer being provided with openings. Each opening is arranged in such a manner that the contact pads are accessible, and solder balls are mounted on each of the contact pads through the openings.

REFERENCES:
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6413799 (2002-07-01), Lam
patent: 7125748 (2006-10-01), Grigg et al.
patent: 7145225 (2006-12-01), Lee

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