Structure for composite bumps

Details Structure for composite bumps Structure for composite bumps

1997-03-10

1999-03-02

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257738, 257734, H01L 2348, H01L 2352, H01L 2940

Patent

active

058775560

ABSTRACT:
A composite bump structure comprising a first metal layer, a polymer bump formed on the first metal layer, and a second metal layer covering the polymer bump and the first metal layer. The first metal layer is formed above an input/output pad on an integrated circuit element. The polymer bump is positioned substantially off the center of the input/output pad. An open area next to the polymer bump above the input/output pad is established for probing test. The open area having the first and second metal layers and the input/output pad underneath can provide good testability.

REFERENCES:
patent: 5122861 (1992-06-01), Tamura et al.
patent: 5130779 (1992-07-01), Agarwala et al.
patent: 5393697 (1995-02-01), Chang et al.
patent: 5431328 (1995-07-01), Chang et al.
patent: 5477087 (1995-12-01), Kawakita et al.
patent: 5545589 (1996-08-01), Tomura et al.

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