Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1997-02-27
1999-03-30
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257738, 257778, 257780, H01L 2348, H01L 2352, H01L 2940
Patent
active
058893261
ABSTRACT:
Au bump is provided on an Al pad of a semiconductor chip. Substrate pads are arranged at predetermined pitches on a circuit board. In each substrate pad, the length (L) of a first side parallel to the array direction is shorter than the length (M) of a second side which is orthogonal to the first side. The substrate pads are formed so that the length (L) of the first side is smaller than the diameter of the Au bump and the length (M) of the second side is larger than the diameter of the Au bump. A solder bump is formed on each substrate pad and it melts to cover the Au bump. At the time of bonding, the width of the solder bump in the direction parallel to the first side is smaller than the diameter of the Au bump, and the width thereof in the direction parallel to the second side is greater than the diameter of the Au bump.
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Y. Tsukada et al., "The Design of Flipchip Joint by Other Metal Bump -Flip Chip Aattach Technology", IMC 1994 Proceeding, Omiya, Apr. 20-Apr. 22, 1994, pp. 419-424.
Y. Tsukada et cl., "The Design and Reliability of Flipchip Attach Joint on Surface Laminar Circuit", ISHM'93 Proceedings, pp. 349-354.
Arroyo Teresa M.
NEC Corporation
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