LandOfFree - US Patents

Quad density optical data system

Registers – Records

Measuring and testing – Fluid pressure gauge

Quad disk static pressure probe

Radiant energy – Invisible radiant energy responsive electric signalling – Infrared responsive

Quad element intrusion detection

Boots – shoes – and leggings

Quad exchange power controller

Electrical connectors – With insulation other than conductor sheath – Insulating body having plural mutually insulated terminals...

Quad field data distribution system with fiber optic converter

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Quad flat flip chip package and leadframe thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Quad flat flip chip packaging process and leadframe therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...

Quad flat no lead (QFN) grid array package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Quad flat no lead (QFN) grid array package, method of making...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor

Quad flat no-lead (QFN) chip package assembly apparatus and...

Static information storage and retrieval – Systems using particular element – Magnetoresistive

Quad flat no-lead (QFN) grid array package, method of making...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...

Quad flat no-lead (QFN) grid array package, method of making...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond

Quad flat no-lead chip carrier

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices

Quad flat no-lead chip carrier with stand-off

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Quad flat no-lead package structure and manufacturing method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Quad flat non-lead package of semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Quad flat non-leaded chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Quad flat non-leaded package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Quad flat non-leaded package and leadframe for use in a quad...