Quad flat no lead (QFN) grid array package, method of making...

Details Quad flat no lead (QFN) grid array package, method of making... Quad flat no lead (QFN) grid array package, method of making...

2005-11-22

2005-11-22

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S123000, C438S124000, C438S127000, C438S690000, C438S693000, C438S759000, C438S940000, C438S977000

Reexamination Certificate

active

06967125

ABSTRACT:
A quad flat no-lead (QFN) grid array semiconductor package and method for making the same is disclosed. The package includes a semiconductor die and a lead frame having a plurality of conductive elements patterned in a grid-type array. A plurality of bond pads on the semiconductor die is coupled to the plurality of conductive elements, such as by wire bonding. The semiconductor die and at least a portion of the lead frame are encapsulated in an insulative material, leaving the conductive elements exposed along a bottom major surface of the package for subsequent electrical connection with higher-level packaging. Individual conductive lead elements, as well as the grid array pattern, are formed by wire bonding multiple bond pads to a single lead at different locations and subsequently severing the lead between the bonding locations to form multiple conductive elements from each individual lead.

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Australian Search Report dated Sep. 8, 2004, 4 pages.

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