Quad flat flip chip packaging process and leadframe therefor

Details Quad flat flip chip packaging process and leadframe therefor Quad flat flip chip packaging process and leadframe therefor

2006-04-04

2006-04-04

Le, Thao P. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S106000, C257S778000

Reexamination Certificate

active

07022551

ABSTRACT:
A quad flat flip chip packaging process and a leadframe therefor are provided. A sacrificial film is attached on the leads of the leadframe for limiting the extent of bumps when formed and saving the manufacturing cost. Besides, the sacrificial film can be removed from the leadframe after a reflow step. Thus, the delamination between the molding compound material and the leads can be prevented during the molding step.

REFERENCES:
patent: 2004/0046264 (2004-03-01), Ho et al.
patent: 2005/0156296 (2005-07-01), Wang et al.

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