High density three-dimensional IC interconnection
High density wire bond BGA
High frequency gallium arsenide MMIC die coating method
High performance amine based no-flow underfill materials for...
High performance flip chip package
High performance multi-chip flip chip package
High performance multi-chip flip chip package
High performance reworkable heatsink and packaging structure...
High performance thermal interface curing process for...
High power MCM package with improved planarity and heat...
High precision die bonding apparatus
High speed IC package configuration
High-aspect-ratio metal-polymer composite structures for...
High-contrast laser mark on substrate surfaces
High-density interconnection of temperature sensitive...
High-frequency module and method for manufacturing the same
High-frequency module, method of manufacturing thereof and...
High-power double throw lever zip socket
High-voltage module and method for producing same
Highly integrated chip-on-chip packaging