Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-10-24
2006-10-24
Lee, Eddie C. (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S637000, C438S461000, C438S125000, C438S113000, C438S121000, C438S126000, C257S728000, C257S702000, C257S704000
Reexamination Certificate
active
07125744
ABSTRACT:
In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal electronic components. Furthermore, a metal thin film is formed on the surface of the insulating resin. This metal thin film provides an electromagnetic wave shielding effect.
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Kanazawa Kunihiko
Takehara Hideki
Yoshikawa Noriyuki
Hamre, Schumann, Mueller & Larons, P.C.
Im Junghwa
Lee Eddie C.
Matsushita Electric - Industrial Co., Ltd.
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