Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-01-03
2006-01-03
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S106000, C438S112000, C438S118000, C219S678000, C219S690000, C219S759000, C257S675000, C257S706000, C257S719000, C257S796000
Reexamination Certificate
active
06982192
ABSTRACT:
An integrated circuit package which has a thermal epoxy that can be attached to an integrated circuit and a thermal element. The thermal epoxy can be cured with energy at a microwave frequency. Curing the thermal epoxy with microwave energy can minimize package warpage during the curing process.
REFERENCES:
patent: 4681996 (1987-07-01), Collins et al.
patent: 4975142 (1990-12-01), Iannacone et al.
patent: 5072283 (1991-12-01), Bolger
patent: 5321222 (1994-06-01), Bible et al.
patent: 5521360 (1996-05-01), Johnson et al.
patent: 5523260 (1996-06-01), Missele
patent: 5721286 (1998-02-01), Lauf et al.
patent: 5734201 (1998-03-01), Djennas et al.
patent: 5789270 (1998-08-01), Jeng et al.
patent: 5844217 (1998-12-01), Hawley et al.
patent: 5909056 (1999-06-01), Mertol
patent: 5977626 (1999-11-01), Wang et al.
patent: 5981312 (1999-11-01), Farquhar et al.
patent: 6003586 (1999-12-01), Beane
patent: 6014999 (2000-01-01), Browne
patent: 6069023 (2000-05-01), Bernier et al.
patent: 6104090 (2000-08-01), Unger et al.
patent: 6146921 (2000-11-01), Barrow
patent: 6191360 (2001-02-01), Tao et al.
patent: 6201301 (2001-03-01), Hoang
patent: 6208519 (2001-03-01), Jiang et al.
patent: 6226187 (2001-05-01), Questad et al.
patent: 6236568 (2001-05-01), Lai et al.
patent: 6261404 (2001-07-01), Baska et al.
patent: 6306680 (2001-10-01), Fillion et al.
patent: 6335548 (2002-01-01), Roberts et al.
patent: 6413353 (2002-07-01), Pompeo et al.
patent: 6457506 (2002-10-01), Lowry
patent: 6461691 (2002-10-01), Taylor et al.
patent: 6547506 (2003-04-01), Jacob
patent: 63-36091 (1987-02-01), None
Jow, “Dielectric and Temperature Measurements During Microwaver Curing of Epoxy in a Sweeping Resonant Cqavity”, 1987 IEEE, p. 465-468.
Sur Biswajit
Vodrahalli Nagesh
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Jr. Carl Whitehead
Mitchell James
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