High precision die bonding apparatus

Details High precision die bonding apparatus High precision die bonding apparatus

2005-12-12

2010-06-01

Le, Thao X (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257SE21088, C029S721000

Reexamination Certificate

active

07727800

ABSTRACT:
A die bonding apparatus and a bonding method are provided wherein the apparatus comprises a bond head movable between a supply of semiconductor dice and a die bonding site, a pick-up tool attached to the bond head for holding a die to be bonded at the die bonding site and an optical assembly positioned for viewing an orientation of the die bonding site. The bond head is configured such that an orientation of the die being held by the pick-up tool between the optical assembly and the die bonding site is viewable by the optical assembly, whereby the orientation of the die may be aligned with the orientation of the die bonding site.

REFERENCES:
patent: 2004/0244915 (2004-12-01), Lam et al.

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