High-power double throw lever zip socket

Details High-power double throw lever zip socket High-power double throw lever zip socket

2005-12-06

2005-12-06

Geyer, Scott (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

06972213

ABSTRACT:
A system for providing electrical contacts between a die and an electrical device includes a package having a first major surface, a second major surface, a first scalloped edge, a second scalloped edge, and a solid end adapted for insertion into a slot. The solid end for carries power to the die or input/output signals. The scalloped edges also carry power. The package includes a plurality of electrical pins which carry input/output signals as well as power. The socket of the system includes a base having an opening therein adapted to receive the package. A cover with openings for receiving the pins covers the base. A power contact unit includes a pair of scalloped edges and a slot. The power contact unit and the cover moves with respect to the base of the socket.

REFERENCES:
patent: 5012924 (1991-05-01), Murphy
patent: 5513076 (1996-04-01), Werther
patent: 5810609 (1998-09-01), Faraci et al.
patent: 5985697 (1999-11-01), Chaney et al.
patent: 6016254 (2000-01-01), Pfaff
patent: 6243267 (2001-06-01), Chuang
patent: 6435893 (2002-08-01), Kasahara
patent: 6439912 (2002-08-01), Andric et al.
patent: 2002/0151203 (2002-10-01), Sagano et al.

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