Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2007-10-22
2008-10-14
Schillinger, Laura M (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S119000, C438S120000
Reexamination Certificate
active
07435622
ABSTRACT:
A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are soldered to the heatsink base frame. A solder release layer is applied to an outer surface of the heatsink base frame. The solder release layer has a lower melting temperature range than each solder used for securing the selected one of the heatpipe or the vapor chamber, and the plurality of parallel fins to the heatsink base frame. After the solder release layer is applied, the heatpipe or the vapor chamber is filled with a selected heat transfer media.
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Colbert John Lee
Hoffmeyer Mark Kenneth
International Business Machines - Corporation
Pennington Joan
Schillinger Laura M
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