Heat-dissipating package for microcircuit devices and process fo
Heat-dissipating structure for integrated circuit package
Heat-radiating tape carrier package and method for...
Heatsink apparatus and thermally-conductive intermediate...
Hermetic cold weld seal
Hermetic package for multiple contact-sensitive electronic...
Hermetic sealing of a substrate of high thermal conductivity usi
Hermetic thin film metallized sealband for SCM and MCM-D modules
Hermetically sealed micro-device package with window
High capacitance package substrate
High density 3-D integrated circuit package
High density chip level package for the packaging of...
High density direct connect LOC assembly
High density electronic interconnection
High density flip chip BGA
High density flip chip BGA
High density leaded ball-grid array package
High density modularity for IC's
High density semiconductor package and method of fabrication
High density stackable and flexible substrate-based devices...