Heat-radiating tape carrier package and method for...

Details Heat-radiating tape carrier package and method for... Heat-radiating tape carrier package and method for...

2006-10-25

2009-10-13

Lee, Calvin (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S777000

Reexamination Certificate

active

07601561

ABSTRACT:
A tape carrier package may include an interposer having a first surface and a second surface. The first surface of the interposer may be attached to an exposed active surface of a semiconductor chip. A heat sink may be attached to the second surface of the interposer.

REFERENCES:
patent: 6022759 (2000-02-01), Seki et al.
patent: 6646335 (2003-11-01), Emoto
patent: 11-127275 (1999-05-01), None
patent: 2000-323627 (2000-11-01), None
patent: 2001-118949 (2001-04-01), None
patent: 2005-38940 (2005-04-01), None

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