Heatsink apparatus and thermally-conductive intermediate...

Details Heatsink apparatus and thermally-conductive intermediate... Heatsink apparatus and thermally-conductive intermediate...

2006-07-11

2006-07-11

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257S796000

Reexamination Certificate

active

07074653

ABSTRACT:
A semiconductor package comprising a die adjacent a lead frame die pad, said lead frame die pad adapted to dissipate heat from the die. The package further comprises a thermally-conductive material abutting the die and a heatsink abutting the thermally-conductive material, said heatsink facing a direction opposite from the lead frame die pad.

REFERENCES:
patent: 5533256 (1996-07-01), Call et al.
patent: 6326678 (2001-12-01), Karnezos et al.
patent: 6918178 (2005-07-01), Chao et al.

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