High density 3-D integrated circuit package

Details High density 3-D integrated circuit package High density 3-D integrated circuit package

2007-02-13

2007-02-13

Zarneke, David A. (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257SE21505

Reexamination Certificate

active

11179377

ABSTRACT:
A slotted file is created by connecting two side walls and a back wall. The side walls have etched grooves facing directly across from each other. The platelet has flanges that fit into the grooves. In one embodiment, a completed cube is formed when the platelets fill the slotted file.

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