High capacitance package substrate

Details High capacitance package substrate High capacitance package substrate

2005-04-12

2005-04-12

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

Reexamination Certificate

active

06878572

ABSTRACT:
A high capacitance substrate. The substrate includes a core tolerant to sintering thereon of a high k material to provide increased capacitance. The core may be non-ceramic. The material sintered thereon may have a dielectric constant in excess of about 4. The substrate may be a package substrate electrically coupled to a die.

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patent: 20020080556 (2002-06-01), Japp et al.
Young, K.F. and Frederikse, H.P.R, J. Phys. Chem. Ref. Data, 2, 313, (1973), sect. 12, pp 48.

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