Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent
1996-10-24
2000-04-04
Chaudhuri, Olik
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
438108, 438118, 438125, 438126, H01L 2144
Patent
active
060460741
ABSTRACT:
A module for encapsulating a microelectronic device has a polished mating surface around the periphery of the substrate on which is deposited at least one thin film sealband fabricated at a temperature no greater than about 400.degree. C. The sealband has a thickness of less than about 0.001 in. and comprising a metal capable of wetting molten solder which has a melting point no greater than about 400.degree. C. and adhering to the solder after solidification. A layer of the solder is disposed between the sealbands of the cap and substrate forming a hermetic seal for the module.
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McHerron Dale C.
Toy Hilton T.
Chambliss Alonzo
Chaudhuri Olik
International Business Machines - Corporation
Tomaszewski John J.
Townsend Tiffany L.
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