Flip-chip adaptor package for bare die
Flip-chip package with underfill having low density filler
Flip-chip packaging of a photo-sensor die on a transparent...
Flip-chip system and method of making same
Forming a chip package having a no-flow underfill
Grooved substrates for uniform underfilling solder ball...
Hermetic thin film metallized sealband for SCM and MCM-D modules
High performance reworkable heatsink and packaging structure...
Hollow package manufacturing method
Increasing the gap between a lead frame and a semiconductor die
Insulation and reinforcement of individual bonding wires in...
Integrated circuit package and method
Integrated package and methods for making same
Interconnect assembly and Z-connection method for fine pitch...
Interconnect for improved die to substrate electrical coupling
Interconnect for packaging semiconductor dice and...
Interconnect structure for an integrated circuit and...
Laminated multilayer substrates
Lead-on-chip semiconductor device package having an adhesive lay
Lead-on-chip semiconductor package and method for making the sam