Flip-chip packaging of a photo-sensor die on a transparent...

Details Flip-chip packaging of a photo-sensor die on a transparent... Flip-chip packaging of a photo-sensor die on a transparent...

2006-09-15

2009-02-24

Pizarro, Marcos D. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S064000, C438S456000, C257SE23132

Reexamination Certificate

active

07494848

ABSTRACT:
An electronic package for a photo-sensing device is provided. The package is formed to include a substrate of a material substantially transparent to light within a predetermined range of wavelengths. The package further formed to include at least one photo-sensing die having a photo-sensing area defined on a front side thereof. The photo-sensing die is mounted to the substrate by a plurality of interconnection joints disposed about the photo-sensing area, whereby the front side of the photo-sensing die is spaced by a gap from a front surface of the substrate. A sealing structure is formed to extend about the interconnection joints to fill portions of the gap thereabout, such that the sealing structure contiguously encloses an internal cavity in substantially sealed manner between the photo-sensing die and substrate. This internal cavity communicates with the photo-sensing area of the photo-sensing die.

REFERENCES:
patent: 2001068654 (2001-03-01), None

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