Insulation and reinforcement of individual bonding wires in...

Details Insulation and reinforcement of individual bonding wires in... Insulation and reinforcement of individual bonding wires in...

2007-04-10

2007-04-10

Ngô, Ngân V. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S119000

Reexamination Certificate

active

10993570

ABSTRACT:
In an integrated circuit package, a method for insulation and reinforcement of individual bonding wires in an integrated circuit package. Using an airbrush, bonding wires are sprayed and coated with an insulating material prior to the molding process. Mold flow induced short rejects are eliminated as a result of: (a) Electrically insulating the bonding wires by coating them with an insulating mixture; (b) Physically isolating the bonding wires as a result of bead formation around individual bonding wires, with the insulating beads acting as contact barriers between the bonding wires; and (c) Enhancing the structural rigidity of the bonding wires as a result of the coating. Reinforcement and separation of bonding wires also reduces inductive coupling and/or crosstalk interference due to proximity of bonding wires.

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