Interconnect for improved die to substrate electrical coupling

Details Interconnect for improved die to substrate electrical coupling Interconnect for improved die to substrate electrical coupling

2006-08-11

2009-06-23

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C257S783000, C257SE21514, C257SE23018

Reexamination Certificate

active

07550318

ABSTRACT:
A method is provided for forming peripheral contacts between a die and a substrate. In accordance with the method, a die (305) is provided which has first and second opposing major surfaces, wherein the first major surface is attached to a substrate (303) having a first group (323) of contact pads disposed thereon, and wherein the second major surface has a second group (311) of contact pads disposed thereon. An electrically conductive pathway (326) is formed between the first and second groups of contacts with an electrically conductive polymeric composition.

REFERENCES:
patent: 5600183 (1997-02-01), Gates, Jr.
patent: 5891761 (1999-04-01), Vindasius et al.
patent: 6420208 (2002-07-01), Pozder et al.
patent: 6509207 (2003-01-01), Liu
patent: 6875367 (2005-04-01), Hsieh et al.
patent: 6878305 (2005-04-01), Hsieh et al.
patent: 6897553 (2005-05-01), King et al.

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