Increasing the gap between a lead frame and a semiconductor die

Details Increasing the gap between a lead frame and a semiconductor die Increasing the gap between a lead frame and a semiconductor die

1999-03-08

2000-10-17

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438115, 438123, 438124, 438126, 438127, H01L 2150, H01L 2148, H01L 2144

Patent

active

06133068&

ABSTRACT:
Apparatus and method of increasing the distance of the gap between a lead frame and a semiconductor die surface in a package assembly. An adhesive layer and a gap increasing layer are disposed between the lead frame and the semiconductor die surface. The gap increasing layer has a thickness selected to reduce likelihood of package particles from being trapped between the lead frame and the die surface. The gap increasing layer includes silver plating, and has a thickness of at least about 300 to 500 microinches.

REFERENCES:
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5260234 (1993-11-01), Long
patent: 5436410 (1995-07-01), Jain et al.
patent: 5585600 (1996-12-01), Froebel et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5789803 (1998-08-01), Kinsman
patent: 6005286 (1998-08-01), Kinsman

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