Grooved substrates for uniform underfilling solder ball...

Details Grooved substrates for uniform underfilling solder ball... Grooved substrates for uniform underfilling solder ball...

2006-04-25

2006-04-25

Clark, S. V. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S108000

Reexamination Certificate

active

07033864

ABSTRACT:
A semiconductor assembly (300) comprising a semiconductor device (301), which has a plurality of metallic contact pads (302) and an outline by sides (303). A metallic bump (304) made of reflowable metal is attached to each of these contact pads. An electrically insulating substrate (305) has a surface with a plurality of metallic terminal pads (306) in locations matching the locations of the device contact pads, and further a plurality of grooves (310) and humps (311) distributed between the terminal pad locations, complementing the distribution of the terminal pads. Each bump is further attached to its matching terminal pad, respectively; the device is thus interconnected with the substrate and spaced apart by a gap (320). Adherent polymeric material (330) containing inorganic fillers fills the gap substantially without voids.

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Dr. Ken Gilleo, “The Chemistry & Physics of Underfill” Tutorial document.
Jinlin Wang, “Underfill of Flip Chip on Organic Substrate: Viscosity, Surface Tension, and Contact Angle” Microelectronics Reliability, 42, pp. 293-299, 2002.

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