Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent
1998-12-04
1999-10-26
Bowers, Charles
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
438112, 438122, 257675, 257676, 257707, 257783, H01L 2144, H01L 2148, H01L 2150
Patent
active
059727365
ABSTRACT:
An integrated circuit package with heat slug is disclosed. The heat slug is thermally coupled to one or more semiconductor die using a single layer of high conductivity adhesive. The assembly process of this invention includes the steps of initially attaching a temporary heat slug to the back side of a package body, to which one or more semiconductor die are attached. The semiconductor die are then electrically connected to the package body and encapsulated to maintain fixed positions within the package cavity. The temporary heat slug is then moved and a final heat slug is attached to the package body and the back side of the one or more semiconductor dies utilizing a single layer of high conductivity adhesive. The package is compact, has reduced complexity, and is inexpensive to manufacture.
REFERENCES:
patent: 4698662 (1987-10-01), Young et al.
patent: 4876588 (1989-10-01), Miyamoto
patent: 4926242 (1990-05-01), Itoh et al.
patent: 5012386 (1991-04-01), McShane et al.
patent: 5109317 (1992-04-01), Miyamoto et al.
patent: 5198889 (1993-03-01), Hisano et al.
patent: 5345107 (1994-09-01), Daikoku et al.
patent: 5362680 (1994-11-01), Heinen
patent: 5367193 (1994-11-01), Malladi
patent: 5404273 (1995-04-01), Akagawa
patent: 5672548 (1997-09-01), Culnane
"Electronic Packaging & Interconnection Handbook" by Charles A. Harper, Dated Nov. 3, 1992, Published by: McGraw-Hill, Inc. Subject: Hybrid Microelectronic Packaging.
Ettehadieh Ehsan
Lee Mario J.
Malladi Deviprasad
Mitty Nagaraj
Berezny Nema
Bowers Charles
Caserza Steven F.
Sun Microsystems Inc.
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