Lead-on-chip semiconductor package and method for making the sam

Details Lead-on-chip semiconductor package and method for making the sam Lead-on-chip semiconductor package and method for making the sam

1997-04-17

1999-08-03

Tsai, Jey

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438123, H01L 2144, H01L 2148, H01L 2150

Patent

active

059337087

ABSTRACT:
A method for bonding a semiconductor chip to a lead frame in a LOC type semiconductor package in which a plurality of inner leads are bonded to an active surface of the semiconductor chip. A semiconductor chip is prepared with a partially-cured polyimide layer on the active surface. One or more strips of polyimide tape is attached to the inner leads. The semiconductor chip is attached to the inner leads by making an intermediate pressure bond between the polyimide tape and the partially-cured polyimide coating layer on the active surface. The polyimide coating layer is then cured.

REFERENCES:
patent: 5286679 (1994-02-01), Farnworth et al.

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