Integrated silicon vacuum micropackage for infrared devices
Integrated void-free process for assembling a solder bumped...
Integrated-circuit package for proximity communication
Interlocking conductor method for bonding wafers to produce...
Inverted chip bonded module with high packaging efficiency
Large area printing method for integrating device and...
Large bumps for optical flip chips
Laser diode packaging
Laser lift-off of sapphire from a nitride flip-chip
Layer transfer process and functionally enhanced integrated...
Layered chip package and method of manufacturing same
Layered chip package and method of manufacturing same
Layered chip package with wiring on the side surfaces
Lead frame and method of producing the same, and...
Lead frame routed chip pads for semiconductor packages
Leaded stacked packages having elevated die paddle
Leadframe of a leadless flip-chip package and method for...
Leadframe with a chip pad for two-sided stacking and method...
Liquid epoxy resin composition and semiconductor device
Low cost and compliant microelectronic packages for high I/O...