Large bumps for optical flip chips

Details Large bumps for optical flip chips Large bumps for optical flip chips

2005-08-23

2005-08-23

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S778000, C228S180220

Reexamination Certificate

active

06933171

ABSTRACT:
The invention provides bumps between a die and a substrate with a height greater than or equal to a height of a waveguide between the die and the substrate. The bumps may be formed on a die prior to that die being singulated from a wafer.

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patent: 2001/0018230 (2001-08-01), Jimarez et al.
patent: 2003/0206680 (2003-11-01), Bakir et al.
patent: 2004/0070080 (2004-04-01), Pendse

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