Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-03-27
2008-07-29
Parekh, Nitin (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S109000, C438S123000, C257SE23039
Reexamination Certificate
active
07405104
ABSTRACT:
A resin-encapsulated semiconductor device includes a semiconductor chip, a plurality of inner leads that are connected to a group of electrodes of the semiconductor chip, respectively, and an encapsulating resin that encapsulates a connection part located between the semiconductor chip and the inner leads. Each of the inner leads includes a protruded portion provided on a surface thereof on an outer side relative to the periphery of the semiconductor chip. The protruded portion protrudes in a thickness direction and is provided with a step portion formed in its side portion. The group of electrodes of the semiconductor chip is connected to surfaces of inner portions of the inner leads located on an inner side relative to their protruded portions, through electroconductive bumps, respectively. The encapsulating resin encapsulates the semiconductor chip and the electroconductive bumps and is formed to expose surfaces of the protruded portions. The surfaces of the protruded portions that function as external terminals can be reduced in size and thereby the pitch between the external terminals can be reduced.
REFERENCES:
patent: 5471088 (1995-11-01), Song
patent: 6303997 (2001-10-01), Lee
patent: 6337510 (2002-01-01), Chun-Jen et al.
patent: 6525406 (2003-02-01), Chung et al.
patent: 6605866 (2003-08-01), Crowley et al.
patent: 6700187 (2004-03-01), Paek
patent: 6730544 (2004-05-01), Yang
patent: 6759737 (2004-07-01), Seo et al.
patent: 2001/0040286 (2001-11-01), Fujimoto et al.
patent: 2003/0001252 (2003-01-01), Ku et al.
patent: 2000-307049 (2000-11-01), None
patent: 2001-077277 (2001-03-01), None
patent: 2001-284523 (2001-10-01), None
patent: 2002-043554 (2002-02-01), None
Fukuda Toshiyuki
Horiki Hiroshi
Minamio Masanori
Hamre Schumann Mueller & Larson P.C.
Matsushita Electric - Industrial Co., Ltd.
Parekh Nitin
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