Layered chip package and method of manufacturing same

Details Layered chip package and method of manufacturing same Layered chip package and method of manufacturing same

2008-06-30

2010-06-29

Trinh, Hoa B (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S612000, C438S617000, C257S781000, C257S786000, C257SE23194

Reexamination Certificate

active

07745259

ABSTRACT:
A layered chip package includes: a main body including a plurality of layer portions; wiring disposed on a side surface of the main body; a plurality of first terminals disposed on a top surface of the main body; and a plurality of second terminals disposed on a bottom surface of the main body. Each layer portion includes a semiconductor chip, an insulating portion covering at least one side surface of the semiconductor chip, and a plurality of electrodes connected to the semiconductor chip. Each electrode has an end face surrounded by the insulating portion and located at the side surface of the main body on which the wiring is disposed. The wiring is connected to the end faces of the plurality of electrodes of the plurality of layer portions, and to the plurality of first and second terminals.

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