Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2009-08-20
2010-12-21
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE21499
Reexamination Certificate
active
07855101
ABSTRACT:
A structure for a semiconductor components is provided having a device layer sandwiched on both sides by other active, passive, and interconnecting components. A wafer-level layer transfer process is used to create this planar (2D) IC structure with added functional enhancements.
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Furman Bruce K.
Purushothaman Sampath
Sankarapandian Muthumanickam
Topol Anna
International Business Machines - Corporation
Le Thao P.
Morris Daniel P.
Trepp Robert M.
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