4. Semiconductor device manufacturing: process
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Spin coating for maximum fill characteristic yielding a...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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SRAM cell having stepped boundary regions and methods of...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Stable high voltage semiconductor device structure

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Field plate electrode
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Stacked devices

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having air-gap dielectric
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STI film property using SOD post-treatment

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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STI formation for vertical and planar transistors

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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STI formation in semiconductor device including SOI and bulk...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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STI forming method for improving STI step uniformity

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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STI leakage reduction

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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STI process

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having air-gap dielectric
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STI process by method of in-situ multilayer dielectric...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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STI process for eliminating silicon nitride liner induced...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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STI process for improving isolation for deep sub-micron...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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STI punch-through defects and stress reduction by high...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive...
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STI scheme to prevent fox recess during pre-CMP HF dip

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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STI stress modulation with additional implantation and...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Storage nitride encapsulation for non-planar sonos NAND...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Strain transformation in biaxially strained SOI substrates...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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Strained semiconductor by full wafer bonding

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Recessed oxide by localized oxidation
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Strained semiconductor by full wafer bonding

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