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HDP gap-filling process for structures with extra step at...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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High aspect ratio high density plasma (HDP) oxide gapfill...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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High aspect ratio trench isolation process for surface...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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High contrast, low noise alignment mark for laser trimming of re

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having substrate registration feature
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High density isolation using an implant as a polish stop

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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High density trench fill due to new spacer fill method...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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High performance semiconductor devices fabricated with...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive...
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High performance strained CMOS devices

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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High permeability layered films to reduce noise in high...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Having air-gap dielectric
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High Q inductor integration

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Isolation by pn junction only
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High quality isolation for high density and high performance int

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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High quality isolation structure formation

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive...
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High resistivity silicon wafer with thick epitaxial layer...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
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High temperature local oxidation of silicon for fine line patter

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Recessed oxide by localized oxidation
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High temperature sensors utilizing doping controlled,...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
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High throughput chemical vapor deposition process capable of fil

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
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High voltage integrated switching devices on a bonded and...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
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High-frequency line

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
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High-frequency wireless communication system on a single ultrath

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
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High-quality SGOI by annealing near the alloy melting point

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Total dielectric isolation
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