High performance semiconductor devices fabricated with...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive...

Reexamination Certificate

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C438S405000, C438S433000

Reexamination Certificate

active

06949443

ABSTRACT:
A high performance semiconductor device and the method for making same is disclosed with an improved drive current. The semiconductor device has source and drain regions built on an active region, a length of the device being different than a width thereof. One or more isolation regions are fabricated surrounding the active region, the isolation regions are then filled with an predetermined isolation material whose volume shrinkage exceeds 0.5% after an anneal process. A gate electrode is formed over the active region, and one or more dielectric spacers are made next to the gate electrode. Then, a contact etch stopper layer is put over the device, wherein the isolation regions, spacers and contact etch layer contribute to modulating a net strain imposed on the active region so as to improve the drive current.

REFERENCES:
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patent: 6309942 (2001-10-01), Tsui et al.
patent: 6429136 (2002-08-01), Miwa
Steegen et al., “Silicide Induced pattern Density And Orientation Dependent Transconductance in MOS Transistors,” 1999 IEEE, IEDM 99, pp. 497-500.
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Dombrowski et al., “Determination Of Stress In Shallow Trench Isolation For Deep Submicron MOS Devices By UV Raman Spectroscopy,” 1999 IEEE, IEDM 99, pp. 357-360.
Scott et al., “NMOS Drive Current Reduction Caused By Transistor Layout And Trench Isolation Induced Stress,” 1999 IEEE, IEDM 99, pp. 827-830.
IBM's Strained Silicon Breakthrough Image, pp. 1-2, cited at http://www.research.ibm.com/resources/press/strainedsilicon/ dated Apr. 8, 2003.
C. K. Maiti et al., “Applications of Silicon-Germanium Heterostructure Devices”, Institute of Physics Publishing, Chapter 2, pp. 32-72, 2001.
Yukihiro Kumagai et al., “Evaluation of change in drain current due to strain in 0.13-um-node MOSFETs”, Extended Abstracts of the 2002 International Conference on Solid State Devices and Materials, pp. 14-15, 2002.

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