High contrast, low noise alignment mark for laser trimming of re

Details High contrast, low noise alignment mark for laser trimming of re High contrast, low noise alignment mark for laser trimming of re

1997-11-17

1999-02-09

Brown, Peter Toby

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having substrate registration feature

438462, 438463, 438700, H01L 21302

Patent

active

058693831

ABSTRACT:
An improved alignment mark used by a laser trimming tool to locate fuses in an underlying integrated circuit is formed using conventional processing sequences. The design features high resolution and improved low noise characteristics. The alignment mark is etched in a shallow layer over a metal layer rather than in the metal itself. The edges which are sensed by the scanning alignment laser of the trimming tool have their elevated portions external to the alignment mark. The improved design replaces a prior art design in which the metal mark protruded from a deep area in the site region. Debris in deep areas adjacent to alignment marks etched in metal, is avoided by the improved design. The absence of this debris virtually eliminates noise in the alignment scan thereby greatly reducing alignment errors.

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