Substrate-holding fixture of non-wettable material

Subtractive metallization structure and method of making

Super high density module with integrated wafer level packages

Super high density module with integrated wafer level packages

Superconductor device and method of manufacturing the same

Superior fill conditions in a replacement gate approach by...

Support structures for wirebond regions of contact pads over...

Support with solder ball elements and a method for...

Supporting control gate connection on a package using...

Suppression of hillock formation in thin aluminum films

Suppression of tungsten film deposition on a semiconductor wafer

Surface barriers for copper and silver interconnects...

Surface mounting method

Surface preparation prior to deposition on germanium

Surface preparation process for damascene copper deposition

Surface treatment and capping layer process for producing a...

Surface treatment of copper to improve interconnect formation

Surface treatment of inter-layer dielectric

Surface treatment of low-K SiOF to prevent metal interaction

Surface treatment of metal interconnect lines