Surface treatment of copper to improve interconnect formation

Details Surface treatment of copper to improve interconnect formation Surface treatment of copper to improve interconnect formation

2006-02-07

2006-02-07

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S679000

Reexamination Certificate

active

06995088

ABSTRACT:
The present invention provides, in one embodiment, a method of forming a copper layer (100) over a semiconductor substrate (105). The method comprises coating a copper seed layer (110) located over a semiconductor substrate with a protective agent (120) to form a protective layer (125). The method also includes placing the semiconductor substrate in an acid bath (145) to remove the protective layer. The method further includes electrochemically depositing a second copper layer (155) on the copper seed layer. Such methods and resulting conductive structures thereof may be advantageously used in methods to manufacture integrated circuits comprising copper interconnects.

REFERENCES:
patent: 6443814 (2002-09-01), Miller et al.
patent: 6464568 (2002-10-01), Miller et al.
patent: 6534117 (2003-03-01), Yoshio et al.
patent: 6719614 (2004-04-01), Miller et al.
J.M. Bastidas, et al.; “Copper Corrosion Mechanism in the Presence of Formic Acid Vapor for Short Exposure Times”; Journal of The Electrochemical Society, 147 (3); pp. 999-1005.
E. Cano, et al; “Study of the Effect of Acetic Acid Vapor on Copper Corrosion at 40 and 80 % Relative Humidity”; Journal of The Electrochemical Society, 148 (11); pp. B431-B437.

Affiliated with

Also associated with

Rating

Surface treatment of copper to improve interconnect formation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Surface treatment of copper to improve interconnect formation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface treatment of copper to improve interconnect formation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3644957