Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-12-28
2010-02-16
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S618000, C438S612000, C438S613000
Reexamination Certificate
active
07662709
ABSTRACT:
An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.
REFERENCES:
patent: 2006/0124703 (2006-06-01), Fang et al.
patent: 2006/0214296 (2006-09-01), Okamoto et al.
patent: 2007/0069346 (2007-03-01), Lin et al.
Chang Chia-Wei
Chen Tsung-Chi
Cheng Sheng-Hong
Hsieh Ming-Chia
Lee Yu-Hsin
Advanced Semiconductor Engineering Inc.
Le Dung A.
Thomas Kayden Horstemeyer & Risley
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