Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2011-05-03
2011-05-03
Sarkar, Asok K (Department: 2891)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S118000, C257SE23069, C257S783000, C257S780000
Reexamination Certificate
active
07935622
ABSTRACT:
A support with solder ball elements for loading substrates with ball contacts is disclosed. One embodiment provides a system for loading substrates with ball contacts and a method for loading substrates with ball contacts. The support has a layer of adhesive applied on one side, the layer of adhesive losing its adhesive force to the greatest extent when irradiated. The support has solder ball elements, which are arranged closely packed in rows and columns on the layer of adhesive in a prescribed pitch for a semiconductor chip or a semiconductor component.
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Bauer Michael
Bemmerl Thomas
Fuergut Edward
Jerebic Simon
Vilsmeier Herman
Dicke, Billig & Czaja P.L.L.C.
Infineon - Technologies AG
Sarkar Asok K
Slutsker Julia
LandOfFree
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