Solving via-misalignment issues in interconnect structures...

SONOS memory device with optimized shallow trench isolation

SONOS-NAND device having a storage region separated between...

Source alternating MOCVD processes to deposit tungsten...

Spacer - defined dual damascene process method

Spacer patterns using assist layer for high density...

Specialized metal profile for via landing areas

Spin-on conductor process for integrated circuits

Spin-on-glass partial etchback planarization process

Split gate non-volatile flash memory cell having a floating...

Split poly-SiGe/poly-Si alloy gate stack

Split poly-SiGe/poly-Si alloy gate stack

Spray dispensing method for applying liquid metal

Spray method for producing semiconductor nano-particles

Spray pyrolysis for large-scale production of chalcopyrite...

Sputter deposition and annealing of copper alloy metallization

Sputter deposition and etching of metallization seed layer...

Sputtered silicon target for fabrication of polysilicon thin...

Sputtered tungsten diffusion barrier for improved...

Sputtering targets comprising aluminides or silicides