Spray dispensing method for applying liquid metal

Details Spray dispensing method for applying liquid metal Spray dispensing method for applying liquid metal

2007-12-11

2010-11-23

Nguyen, Thanh (Department: 2893)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S121000, C438S122000, C257SE21476

Reexamination Certificate

active

07838418

ABSTRACT:
Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die.

REFERENCES:
patent: 5170930 (1992-12-01), Dolbear et al.
patent: 6060117 (2000-05-01), Pergande et al.
patent: 6504242 (2003-01-01), Deppisch et al.
patent: 6523757 (2003-02-01), Bievenue et al.

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