Advanced BEOL interconnect structures with low-k PE CVD cap...
Advanced cobalt silicidation with in-situ hydrogen plasma clean
Advanced contact integration scheme for deep-sub-150 nm devices
Advanced copper damascene structure
Advanced IC bonding pad design for preventing stress induced pas
Advanced seed layers for interconnects
Advanced seed layery for metallic interconnects
Advanced VLSI metallization
Aerogel thin film formation from multi-solvent systems
Agglomeration control using early transition metal alloys
Air break for improved silicide formation with composite caps
Air gap based low dielectric constant interconnect structure and
Air gap for dual damascene applications
Air gap for tungsten/aluminum plug applications
Air gap formation and integration using a patterning cap
Air gap formation for high speed IC processing
Air gap formation method for reducing undesired capacitive...
Air gap interconnect structure and method thereof
Air gap interconnects using carbon-based films
Air gap semiconductor structure and method of manufacture