Integrating metal layers with ultra low-K dielectrics
Integration film scheme for copper / low-k interconnect
Integration flow to prevent delamination from copper
Integration method for raised contact formation for sub-150...
Integration of a variable thickness copper seed layer in...
Integration of ALD tantalum nitride for copper metallization
Integration of annealing capability into metal deposition or...
Integration of low-k SiOF as inter-layer dielectric
Integration of organic fill for dual damascene process
Integration of pore sealing liner into dual-damascene...
Integration of pore sealing liner into dual-damascene...
Integration of silicon-rich material in the self-aligned via...
Integration of titanium and titanium nitride layers
Integration of titanium and titanium nitride layers
Integration of ultra low K dielectric in a semiconductor...
Integration scheme for non-feature-size dependent cu-alloy...
Inter-layer interconnection structure for large electrical...
Inter-metal dielectric film composition for dual damascene...
Inter-metal dielectric patterns and method of forming the same
Interconnect alloys and methods and apparatus using same