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Bilayered metal hardmasks for use in Dual Damascene etch...

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask resist contains inorganic material
Reexamination Certificate

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Etching of hard masks

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask resist contains inorganic material
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Hard mask integrated etch process for patterning of silicon...

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask resist contains inorganic material
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Metal mask etching of silicon

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask resist contains inorganic material
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Method for forming fine grooves and stamper and structure...

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask resist contains inorganic material
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Method for manufacturing a semiconductor device with ultra-fine

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask resist contains inorganic material
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Method of dry etching with hydrogen bromide or bromide

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask resist contains inorganic material
Patent

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Method of making a high-definition printed circuit

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask resist contains inorganic material
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Method to produce masking

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask resist contains inorganic material
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Methods for anisotropic etching of (100) silicon

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask resist contains inorganic material
Patent

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Process for defining a pattern using an anti-reflective coating

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask resist contains inorganic material
Patent

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Semiconductor processing

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask resist contains inorganic material
Patent

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Wafer processing using thermal nitride etch mask

Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Mask resist contains inorganic material
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