Method of making a high-definition printed circuit

Details Method of making a high-definition printed circuit Method of making a high-definition printed circuit

1994-05-04

1995-11-21

Powell, William

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

Mask resist contains inorganic material

216 48, 216 52, 216105, B44C 122, C23F 102

Patent

active

054683459

ABSTRACT:
A method of making printed circuit boards in a continuous process. The method uses copper base metal sputtered onto a substrate. This base metal is much thinner than the base metal normally used in printed circuit processes and ultimately allows a greater number of conductors per unit of length to be made on the boards.

REFERENCES:
patent: 4444619 (1984-04-01), O'Hara
patent: 5242540 (1993-09-01), Ishii et al.

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